NEWS CENTER

In recent years, as the space for perc cells to improve efficiency is gradually exhausted, size upgrading has become an important way to improve the power of photovoltaic modules. However, the dispute between 182 and 210, which lasted for more than a year, eventually evolved into an industry wide internal battle. In the context of rising costs of materials, transportation and land, further improving the conversion efficiency and accelerating the iterative upgrading of n-type technology are becoming the first choice for photovoltaic enterprises to occupy the competitive advantage of the industrial chain. Compared with n-type heterojunction, upgrading perc to TOPCON can maximize the retention and utilization of existing equipment, and mainstream battery enterprises have relevant technical reserves, which is the most competitive and cost-effective technical route for n-type battery manufacturing.

 

1. Cost reduction potential of TOPCON cost reduction.

Reply: TOPCON has great potential for cost reduction. With the continuous improvement of battery process performance, the non silicon cost is bound to decrease; In addition, the consumption and cost of silver paste also have a lot of room to fall; Low investment leads to low depreciation cost of the whole equipment;

 

In addition, key equipment such as boron expansion and LPCVD have also been localized, and the equipment is also committed to large capacity and low operating costs, which is conducive to promoting the cost reduction of TOPCON technology.

 

2. At present, which companies in the industry are using this technology? Is it grafted on the existing production line or a new production line? How effective?

Reply: the industry mainly includes Zhonglai, Trinasolar, etc., which are basically new lines. In addition, it is understood that many enterprises have reserved space for TOPCON upgrade in the new perc production line. At present, the efficiency can reach about 23.5-23.8%, and the yield is basically about 93%-94%.

 

3. In addition to n-type silicon wafers, what new materials does TOPCON need? What are the supply prospects?

Reply: TOPCON technology, n-type and p-type can be made, and there is basically no need for new materials. There is no obvious difference between it and perc's materials, and there is no problem with the overall material supply.

 

4. The difference of different deposition methods (LPCVD PEALD apecvdmaia);

Reply: it is mainly the difference between LPCVD and PECVD. At present, LPCVD has better film-forming quality, large production capacity and convenient maintenance;

Although PECVD deposits rapidly, it may cause film explosion and dust generation.

 

5. Difference between integrated in-situ doping and separate phosphorus injection

Reply: in situ doping will lead to poor uniformity of amorphous silicon because phosphine inhibits the film-forming rate of amorphous silicon. In addition, it should be compatible with uniformity and square resistance, so it will be difficult to control; Using intrinsic phosphorus diffusion will have better compatibility and be easy to control.

 

6. Equipment cost of perc upgrading TOPCON process route;

Reply: it depends on the actual situation. I believe everyone can understand that the general GW level is about 50-60 million at present, for reference only;

 

7. How to detect the thickness of SiO2 during production and operation?

Reply: during production and operation, it is difficult to detect the thickness of silicon dioxide. In fact, we do not recommend to detect silicon dioxide in the production process. It can be seen from the monitoring of other processes, such as square resistance.

 

8. What are the advantages and uniformity of LPCVD?

Reply: the advantages of LPCVD: large capacity, easy maintenance, is a relatively mature equipment; At present, the uniformity can reach the level of 433.

 

9. TOPCON's requirements for slurry?

Reply: the requirements are high. From the overall situation last year, the slurry plays a great role in improving the overall electrical performance, which of course means a large space for cost reduction.

 

10. The influence of the width of the winding plating on the winding plating cleaning, and what are the difficulties of the winding plating cleaning? What are the current cleaning methods for wrapping plating.

Reply: the width of wrapping plating is related to the difficulty of cleaning wrapping plating. The larger the width is, the more difficult it is to clean, such as uneven cleaning, poor appearance or poor el.

At present, the main removal methods of wrapping plating are acid etching and alkali etching.

 

11. Is it necessary to add hot oxygen before passivation of front alumina?

Reply: I don't think it is necessary to increase hot oxygen. At present, the passivation effect of alumina itself is better.

 

12. Can positive alumina be replaced by other passive films

Reply: the positive alumina can be replaced by other passive films, but at present, the passivation effect of alumina itself is relatively good. In addition, its process is relatively mature and the cost is relatively low.

 

13. For TOPCON, what is the difference between PECVD alumina and ALD alumina

Reply: the passivation of TOPCON on suede is carried out on the front, and the growth rate of PECVD is fast, which may cause the passivation effect to be slightly worse than ALD.

 

14. Where is the critical point of the comparative advantage of TOPCON production line equipment investment over perc (how much is the conversion advantage, and how much is the gap in equipment investment). When is this critical point expected to occur.

Reply: personally, I think the critical point is at hand, because the efficiency of perc has basically reached the limit, and TOPCON has GW level mass production in the market, and the overall operation condition is also good. The efficiency can reach 23.3-23.5%, the yield is basically more than 90%, and the operation cost is also constantly decreasing.

 

15. How about the actual yield and mass production efficiency of n-topcon? What is the current domestic scale? In addition, has your company done research and testing with domestic and foreign enterprises on p-topcon? What is the general situation?

Reply: the actual mass production efficiency of n-topcon is 23.5-23.8, and the domestic scale is about 4-5gw. Some research institutions of p-topcon have already done it, and the efficiency is relatively high. P-type TOPCON and n-type TOPCON are only battery route differences.

 

16. At present, the newly built 1GW TOPCON production line is about billions.

Reply: about 250million. Ultimately, it depends on each configuration.

 

17. Is the new TOPCON line compatible with 166 and 210 size batteries

Reply: full size compatibility can be achieved.

 

18. What will the mainstream size and thickness of n-type silicon wafer be in the next two to three years?

Reply: at present, it can only be said that large size is definitely the trend in the future.

 

19. Application of PL technology in TOPCON;

Reply: PL is a standard configuration in TOPCON, which is very helpful for troubleshooting abnormal efficiency and improving efficiency.

 

20. How to solve the problem of wrapping plating on the equipment end and vehicle?

Reply: the wrapping of the equipment is basically controlled at about 1cm from the edge of the silicon wafer, and efforts are being made to develop equipment without wrapping.

 

21. For polysilicon winding cleaning, who has the advantage of acid-base cleaning, and who has the advantage of chain type and groove type;

Reply: at present, both acid and alkali can be removed. Ultimately, it depends on the matching of the process and the comprehensive cost performance.

 

22. Bbr3 or BCl3 gas will be used in n-topcon diffusion process. What are their advantages and disadvantages?

Reply: bbr3 is widely used, especially photovoltaic, so its overall equipment market share is high.

The operating cost of BCl3 includes BOM cost and equipment maintenance cost, and its overall operating cost is better than bbr3.

 

23. Whether TOPCON technology is effectively compatible with existing component technologies, such as lamination, half wafer, large silicon wafer, double-sided, etc.

Reply: TOPCON can be effectively compatible with half wafer, lamination, large silicon wafer and double-sided components;

 

24. Perc+ can be added with TOPCON technology. In addition, how long is the life of LP furnace tube of Laplace?

Reply: there are many ways to prolong the service life of quartz tubes.

 

25. Put the film horizontally, and there will be no heavy boat tooth mark on the lower one? Because gravity compresses, the gas cannot enter.

Reply: No, the boat seal is only related to the quality of the quartz boat or the cleaning saturation process. The best advantage of level is the distribution of gas on the surface of the silicon wafer, and there is also a space between the teeth.

 

26. Under low pressure, the molecular free path is large. How to avoid the insufficient diffusion of the flow state under the horizontal release?

Reply: under low pressure, the molecular free path is large, which is conducive to the uniform distribution of gas. For the horizontal release, there is no barrier to the air flow, so the pressure demand will not be very low, and the requirements for the pump are not as high as those for the vertical and diamond inserts.

 

27. Supporting conditions of horizontal film release automation equipment?

Reply: mainstream automation manufacturers in the market can configure it.

 

28. Can bbr3 be used to replace BCl3, and whether it has the function of in-situ cleaning?

Reply: for us, BCl3 is more effective than bbr3, so we won't consider replacing it. The in-situ cleaning function can be increased according to customer needs.

 

29. Boron diffusion square resistance range and square resistance uniformity?

Reply: 100~120ohm/squ can achieve 4%/4%/3%.

 

30. Is there any special coating for quartz parts? How long is the service life?

Reply: Yes, it works well at present.

 

31. What is the problem of ensuring the uniformity of TOPCON passivation? In what way is this uniformity directly reflected in the electrical performance parameters of the battery? How to ensure the convergence of switching voltage and current? If the light and shade of the battery string are controlled?

Reply: the uniformity of passivation can be achieved as long as the uniformity of passivation process is well done, which is mainly reflected in the opening voltage and FF of electrical parameters;

 

The convergence of switching voltage and current can be guaranteed as long as the manufacturing process is well controlled. The battery shade can refer to perc/hit.